Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
Author:
Pucha Raghuram V.1, Tunga Krishna1, Pyland James1, Sitaraman Suresh K.1
Affiliation:
1. Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Abstract
A field-use induced damage mapping methodology is presented that can take into consideration the field-use thermal environment profile to develop accelerated thermal cycling guidelines for packages intended to be used in military avionics thermal environment. The board-level assembly process mechanics and critical geometric features with appropriate material models are taken into consideration while developing the methodology. The models developed are validated against in-house and published accelerated thermal cycling experimental data. The developed mapping methodology is employed to design alternate accelerated thermal cycles by matching the creep and plastic strain contributions to total inelastic strain accumulation in solder under military field-use and accelerated thermal cycling environments, while reducing the time for accelerated thermal cycling and qualification.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference20 articles.
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