Analytical cutting force modelling of micro-slot grinding considering tool-workpiece interactions on both primary and secondary tool surfaces

Author:

Pratap Ashwani1,Patra Karali2

Affiliation:

1. Department of Mechanical Engineering, Indian Institute of Technology Bombay Powai, Mumbai Mumbai, 400076 India

2. Patliputra Colony Patna, 800013 India

Abstract

Abstract This work presents an analytical cutting force modeling for micro-slot grinding. Contribution of the work lies in the consideration of both primary and secondary tool surface interactions with the work surface as compared to the previous works where only primary tool surface interaction was considered during cutting force modeling. Tool secondary surface interaction with workpiece is divided into two parts: cutting/ ploughing by abrasive grits present in exterior margin of the secondary tool surface and sliding/adhesion by abrasive grits in the inner margins of the secondary tool surface. Orthogonal cutting force model and indentation based fracture model is considered for cutting by both the abrasives of primary tool surface and the abrasives of exterior margin on the secondary surface. Asperity level sliding and adhesion model is adopted to solve the interaction between the workpiece and the interior margin abrasives of secondary tool surface. Experimental measurement of polycrystalline diamond tool surface topography is carried out and surface data is processed with image processing tools to determine the tool surface statistics viz., cutting edge density, grit height distribution and abrasive grit geometrical measures. Micro-slot grinding experiments are carried out on BK7 glass at varying feed rate and axial depths of cut to validate the simulated cutting forces. Simulated cutting forces considering both primary and secondary tool surface interactions are found to be much closer to the experimental cutting forces as compared to the simulated cutting forces considering only primary tool surface interaction.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

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