Modeling of Recast Layer in Micro-Electrical Discharge Machining

Author:

Tan P. C.1,Yeo S. H.1

Affiliation:

1. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798

Abstract

The thickness of recast layers produced during electrical discharge machining (EDM) is an important process performance measure as it may indicate an extent of crack propagation in a machined surface or thickness of a functional layer alloyed onto a machined surface. Thus, the availability of the recast layer thickness prediction models is needed to allow better control of machining outcomes, which becomes more vital for micro-EDM due to the microscale of machined features. The proposed numerical model, based on a multiple discharge approach for recast layer prediction, is developed to fill an existing gap in micro-EDM. The multiple discharge approach accounts for the overlapping nature by which craters are generated on the machined surface and considers the recast layer to be a combination of individual recast regions from individual craters. The numerical analysis, based on finite element methods, is used to determine the melting isotherms due to heat inputs on overlapping crater profiles. Then, a hemispherical-capped crater profile is estimated by applying a recast plasma flushing efficiency to the amount of molten material bounded by the melting isotherm. Finally, the recast region is defined to be bounded by the melting isotherm and crater profile. The model, developed for a peak discharge current of 1.45 A and pulse on time between 166 ns and 606 ns, predicted recast layer thicknesses of between 1.0 μm and 1.82 μm. It is then validated at pulse on time settings of 244 ns and 458 ns, which generated average recast layer thicknesses of 1.18 μm and 1.56 μm, respectively. Thus, the numerical model developed using the multiple discharge approach is suitable for estimation of recast layer thicknesses in micro-EDM.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

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