Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Author:

Subrahmanyam Prabhakar1,Gnanavel B. K.1

Affiliation:

1. Saveetha Engineering College, Anna University, Chennai, Tamil Nadu 602105, India

Abstract

Abstract Detailed heat transfer distributions of multiple microscaled tapered jets orthogonally impinging on the surface of a high-power density silicon wall is presented. The tapered jets issued from two different impingement setup are studied—(a) single circular nozzle and (b) dual circular nozzles. Jets are issued from the inlet(s) at four different Reynolds numbers {Re = 8000, 12,000, 16,000, 20,000}. The spacing between the tapered nozzle jets and the bare die silicon wall (z/d) is adjusted to be 4, 8, 12, and 16 jet nozzle diameters away from impinging influence. The impact of varying the nozzle to the silicon wall (z/d) standoff spacing up to 16 nozzle jet diameters and its effects on flow fields on the surface of the silicon, specifically the entrainment pattern on the silicon surface, is presented. Heat transfer characteristics of impinging jets on the hot silicon wall is investigated by means of large eddy simulations (LES) at a Reynolds of 20,000 on each of the four z/d spacing and compared against its equivalent Reynolds-averaged Navier–Stokes (RANS) cases. Highest heat transfer coefficients are obtained for the dual inlet system. A demarcation boundary region connecting all the microvortices between impinging jets is prominently visible at smaller z/d spacing—the region where the target silicon wall is within the sphere of influence of the potential core of the jet. This research focuses on the underlying physics of multiple tapered nozzles jet impingement issued from single and dual nozzles and its impact on turbulence, heat transfer distributions, entrainment, and other pertinent flow-field characteristics.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference51 articles.

1. A Comprehensive Review of Heat Transfer in Thermoelectric Materials and Devices;Annu. Rev. Heat Transfer,2014

2. TEC Cracking in Temperature Margining Liquid-Cooled Thermal Tools in Post-Silicon Validation,2013

3. Towards a Thermal Moore's Law;IEEE Trans. Adv. Packag.,2007

4. High Flux Heat Removal With Microchannels—A Roadmap of Challenges and Opportunities;Heat Transfer Eng.,2005

5. Density Factor Approach to Representing Impact of Die Power Maps on Thermal Management;IEEE Trans. Adv. Packag.,2005

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