Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem-Reference-Cited by-同舟云学术

Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem

Published:1996-12-01 Issue:4 Volume:118 Page:271-279
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Fisher Timothy S.¹,Zell F. A.²,Sikka Kamal K.¹,Torrance Kenneth E.¹

Affiliation:

1. Sibley School of Mechanical and Aerospace Engineering, Upson Hall, Cornell University, Ithaca, NY 14853

2. The Carborundum Company Microelectronics Division, 10409 South 50th Place, Phoenix, AZ 85044

Abstract

An analytically based approximate solution is presented for the thermal resistance of an axisymmetric heat source mounted on a conductive substrate with bottom- and top-side convective cooling of the substrate. The approximation closely matches an exact solution for bottom-side convective cooling and reference finite element solutions for top-side and both-side cooling over broad ranges of substrate thickness (10−4 ≤ t* ≤ 104 and 10−2 ≤ t* ≤ 102), substrate outer radius (1 ≤ b* ≤ 100) and convective Blot numbers (10-4 to 102). With bottom-side cooling, a minimum in the thermal resistance can occur over a wide range of substrate thicknesses. The approximate solution possesses simplicity and ease of computation as compared to exact or computational solutions for many microelectronic applications.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/118/4/271/5882039/271_1.pdf

Reference23 articles.

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3. Eades, H. H., and Nelson, D. J., 1991, “Thermal Interaction of High-Density Heat Sources on Ceramic Substrates,” Proceedings of the Third ASME-JSME Thermal Engineering Joint Conference, J. R. Lloyd, and Y. Kurosaki (eds.), Reno, NV, March 17–22, Vol. 2, pp. 349–356.

4. Ellison G. N. , 1976, “Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface,” IEEE Transactions on Parts, Hybrids, and Packaging, Vol. PHP-12, No. 3, pp. 265–266.

5. Fisher, T. S., Sikka, K. K., Torrance, K. E., and Zell, F. A., 1994, “Efficient Analytical Approximations to the Heat Source-on-Substrate Problem with Convection,” Report No. E-94-06, Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY. pp. 1–28.

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