Temperature Measurement of Workpieces in Conventional Surface Grinding

Author:

Kato T.1,Fujii Hiroshi1

Affiliation:

1. Department of Mechanical and Systems Engineering, Faculty of Engineering, Gifu University, 1-1 Yanagido, Gifu 501-1193 Japan

Abstract

Temperature at various depths from the ground surface in workpiece is measured accurately by using the newly developed PVD film method, in which a thin film deposited on the workpiece is used as a thermal sensor. The influence of workpiece speed, depth of cut and wheel speed on the temperature of the workpiece was investigated under conventional surface grinding with no grinding fluids. The measured results were compared with Takazawa’s approximation based on Jaeger’s heat conduction solution to the moving heat source problem. The maximum temperature rise at the surface and the temperature gradient close to the surface were obtained and correlated with the residual stress induced at the surface. [S1087-1357(00)70302-9]

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference15 articles.

1. Backer, R. W., Marshall, E. R., and Shaw, M. C., 1952, “The Size Effect in Metal Cutting,” Trans. ASME, 74, pp. 61–72.

2. Snoeys, R., Maris, M., and Peters, J., 1978, “Thermally Induced Damage in Grinding,” CIRP Ann., 27, pp. 571–581.

3. Kovach, J. A., and Malkin, S., 1988, “Thermally Induced Grinding Damage in Superalloy Materials,” CIRP Ann., 37, pp. 309–313.

4. Littman, W. E., and Wulff, J., 1955, “The Influence of the Grinding Process on the Structure of Hardened Steel,” Trans. ASME, 47, pp. 692–714.

5. Sauer, W. J., 1972, “Thermal Aspect of Surface Grinding,” New Developments in Grinding, Proc. International Grinding Conference, Carnegie Press, pp. 391–411.

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