Effects of Elastoplasticity, Damage, and Environmental Exposure on the Behavior of Adhesive Step-Lap Joints

Author:

Michopoulos John G.1,Apetre Nicole A.1,Iliopoulos Athanasios P.1,Steuben John C.1

Affiliation:

1. U.S. Naval Research Laboratory Computational Multiphysics Systems Lab., Materials Science and Technology Division, , Washington, DC 20375

Abstract

Abstract The presence of damage in the adhesive material as well as combined environmental excitation in multi-material adhesive step-lap joints (ASLJs) often encountered in aircraft industries are frequently neglected. Historically, the ASLJ design is based only within the scope of elastoplastic failure. The present work describes the implementation and application of a computational framework enabling the quasistatic performance evaluation of such joints under the simultaneous presence of plasticity, damage, and hygrothermal environmental stimuli. In particular, ASLJ linking Ti–6Al–4V alloy adherents with an FM-300K adhesive are modeled under the proposed framework for various material responses and environmental excitations. It is shown that the assumption of using only elastoplastic failure for the adhesive may not be an adequate assumption for designing and qualifying ASLJs. Specifically, consideration of the presence of plasticity, damage, and environmental effects indicates that there are reasons to re-examine the design practices of such joints and to determine the relevant material constants associated with the multiphysics cross-coupling effects.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications,Software

Reference44 articles.

1. The Detection, Inspection, and Failure Analysis of a Composite Wing Skin Defect on a Tactical Aircraft;Mueller;Compos. Struct.,2016

2. Requirements and Variability Affecting the Durability of Bonded Joints;Jones;Materials,2020

3. Design Methodology for Bonded-Bolted Composite Joints. Vol. I Analysis Derivations and Illustrative Solutions;Hart-Smith,1982

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3