A New Approach to Calculate Atomic Flux Divergence by Electromigration-Reference-Cited by-同舟云学术

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Published:1998-12-01 Issue:4 Volume:120 Page:360-366
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Sasagawa K.¹,Nakamura N.¹,Saka M.¹,Abe´ H.²

Affiliation:

1. Department of Mechanical Engineering, Tohoku University, Aoba01, Aramaki, Aoba-ku, Sendai 980-8579, Japan

2. Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan

Abstract

In this paper, a new calculation method of the atomic flux divergence used to predict the formation of electromigration-induced void is proposed by considering two-dimensional distributions of current density and temperature and also simply considering the line structure of not only polycrystalline, but also bamboo line. For the verification, electromigration phenomenon near the corner of an angled polycrystalline line, which results in two-dimensional distributions of current density and temperature, is treated as an example. The usefulness of the proposed method is discussed in the light of the comparison of prediction of void formation near the corner with the experimental result.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/120/4/360/5801457/360_1.pdf

Reference12 articles.

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