Potential Failure Sites in a Flip-Chip Package With and Without Underfill-Reference-Cited by-同舟云学术

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Published:1998-12-01 Issue:4 Volume:120 Page:336-341
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Madenci E.¹,Shkarayev S.¹,Mahajan R.²

Affiliation:

1. Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, AZ 85726

2. Intel Corporation, Chandler, AZ 85226

Abstract

In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Application of the strain energy density criterion indicates the possible failure sites and how they shift due to the presence of underfill.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/120/4/336/5801383/336_1.pdf

Reference9 articles.

1. Jackson, R., and Carnevali, P., 1991, “Finite Element Modeling of Encapsulated Flip-Chip Packaging Assemblies,” Proceedings 1991 International Symposium on Microelectronics, ISHM, pp. 82–85.

2. Le Gall, A. C., Jianmin, Q., and McDowell, D. L., 1996, “Delamination Cracking in Encapsulated Flip Chips,” 46th Electronic Components and Technology Conference Proceedings, IEEE, Piscataway, NJ, pp. 430–434.

3. Madenci, E., Shkarayev, S., and Sergeev, B., 1998, “Thermo-Mechanical Systems in Regions of Dissimilar Materials via Global-Local Finite Element Analysis,” Theoretical and Applied Fracture Mechanics, in press.

4. Munz D. , FettT., and YangY. Y., 1993, “The Regular Stress Term in Bonded Dissimilar Materials After a Change in Temperature,” Engineering Fracture Mechanics, Vol. 44, pp. 185–194.

5. Persson, E., Madenci, E., and Ericksson, I., 1998, “Prediction of Delamination Initiation in Laminates with Pin-Loaded Holes,” Theoretical and Applied Fracture Mechanics, in press.

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