Debonding in Overmolded Integrated Circuit Packages-Reference-Cited by-同舟云学术

Debonding in Overmolded Integrated Circuit Packages

Published:1993-09-01 Issue:3 Volume:115 Page:249-255
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Hunt S.¹,Carlsson L. A.²

Affiliation:

1. Advanced Manufacturing Technologies, Motorola, Inc., 8000 West Sunrise Blvd., Ft. Lauderdale, FL 33322

2. Department of Mechanical Engineering, Florida Atlantic University, Boca Raton, FL 33431

Abstract

Recently introduced overmolded pad array chip carrier (OMPAC) electronic packages sometimes suffer from debonding between the overmold material and the printed circuit board. In this study, bond strength is characterized by a combination of experimental and analytical methods. Test specimens representative for OMPAC structures were designed, manufactured, and tested to failure in tension and torsion. Finite element stress analysis of the specimens was performed in conjunction with a combined interfacial stress failure criterion to determine interfacial tensile and shear strengths from the measured failure loads.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/115/3/249/5881606/249_1.pdf

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An energy-based failure criterion for delamination initiation in electronic packaging;Journal of Adhesion Science and Technology;2005-01

2. A failure criterion for debonding between encapsulants and leadframes in plastic IC packages;Journal of Adhesion Science and Technology;2000-01

3. Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization;Materials Research Bulletin;1996-11

4. Interface failure criterion of button shear test as a means of interface adhesion measurement in plastic packages;International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

5. An energy-based method to predict delamination in electronic packaging;52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)