Nanoscale Deformation Analysis With High-Resolution Transmission Electron Microscopy and Digital Image Correlation

Author:

Wang Xueju1,Pan Zhipeng1,Fan Feifei1,Wang Jiangwei2,Liu Yang3,Mao Scott X.2,Zhu Ting1,Xia Shuman4

Affiliation:

1. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

2. Department of Mechanical Engineering and Materials Science, University of Pittsburgh, Pittsburgh, PA 15261

3. Center for Integrated Nanotechnologies, Sandia National Laboratories, Albuquerque, NM 87185

4. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332 e-mail:

Abstract

We present an application of the digital image correlation (DIC) method to high-resolution transmission electron microscopy (HRTEM) images for nanoscale deformation analysis. The combination of DIC and HRTEM offers both the ultrahigh spatial resolution and high displacement detection sensitivity that are not possible with other microscope-based DIC techniques. We demonstrate the accuracy and utility of the HRTEM-DIC technique through displacement and strain analysis on amorphous silicon. Two types of error sources resulting from the transmission electron microscopy (TEM) image noise and electromagnetic-lens distortions are quantitatively investigated via rigid-body translation experiments. The local and global DIC approaches are applied for the analysis of diffusion- and reaction-induced deformation fields in electrochemically lithiated amorphous silicon. The DIC technique coupled with HRTEM provides a new avenue for the deformation analysis of materials at the nanometer length scales.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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