Effect of Operational Parameters on the Thermal Performance of Flat Plate Oscillating Heat Pipe

Author:

Mehta Kamlesh K.1,Mehta Nirvesh2,Patel Vivek3

Affiliation:

1. Department of Mechanical Engineering, Gujarat Technological University, Gujarat 382424, India

2. Department of Mechanical Engineering, Government Engineering College, Dahod 389151, Gujara, India

3. Department of Mechanical Engineering, Pandit Deendayal Petroleum University, Gandhinagar, Gujarat 382007, India; Northwestern Polytechnical University, Shaanxi 710072, China

Abstract

Abstract Flat plate oscillating heat pipe (FP-OHP) is a unique heat transfer device and considered as a promising candidate for effective heat transfer device in electronics industries. A number of theoretical studies and experimental investigations have been carried out on FP-OHP in the past decades after its invention. However, due to the operational characteristics of FP-OHP, the effect of various parameters on the thermal performance of FP-OHP has not been completely revealed so far. This paper attempts to discuss the effect of operational parameters on the thermal performance of FP-OHP. In this study, the FP-OHP was investigated with different charge ratios, orientations, working fluids, and heat loads from 10 W to 150 W. In order to investigate the effect, 18 parallel square channels of 2 × 2 mm2 are machined onto pure copper plate (93 × 70 × 8 mm3) to form FP-OHP. DI water, ethanol, methanol, acetone, and FC-72 are investigated. The measured thermal resistance was strongly dependent on operational parameters. The optimum performance was observed with acetone with a charge ratio of 70% in the vertical orientation. The lowest thermal resistance of 0.39 °C/W is achieved using acetone as a working fluid at 100 W. A Kutateladze number (Ku) was used to compare the experimental data and found to be suitable for prediction of the thermal performance of FP-OHP with standard deviation of 15%.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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