Ergonomic Temperature Limits for Handheld Electronic Devices

Author:

Berhe Mulugeta K.1

Affiliation:

1. Intel Corporation, Santa Clara, CA

Abstract

In the drive towards smaller but more powerful electronic systems, effective thermal management issues continue to be among the key challenges facing the electronic industry. With this drive comes increasing heat production that must be removed for a satisfactory and safe operation. In large systems, one of the main challenges is how to achieve acceptable junction temperature of components such as microprocessors. In small systems such as handheld devices, however, one of the main challenges is maintaining the enclosure temperature below certain threshold so that they can be handled and operated without much discomfort. Whether the device is cooled passively or actively, a portion of the total heat generated by components is dissipated through the enclosure. This heat is then dissipated from the skin by radiation and natural convection into the ambient, and by conduction into any body that is in touch with it. So, when a device is held by hand, part of the heat produced will flow into the hand by conduction. The higher the temperature of the enclosure, the greater the heat transfer into the hand will be. Thus, whereas some devices feel cool to the touch, others will feel hot when touched. In order to characterize touch comfort, we must answer some basic questions: What determines whether a device feels hot or not? That is, what are the variables that control touch comfort? Is there a maximum skin temperature limit that we can say is acceptable for touch comfort? In this paper, we shall attempt to answer these and related questions. Among the results we report in this paper include that touch comfort not only depends on the absolute enclosure temperature of the device but also on the thermal conductivity of the enclosure. Materials with high conductivity transfer greater amount of heat into the hand than materials with low conductivity. Thus, a device with aluminum enclosure will feel hotter when touched than a device with plastic enclosure dissipating the same amount of heat. Further, depending on enclosure material type and ambient conditions, one can identify a skin temperature limit beyond which touch comfort deteriorates and becomes unacceptable. For the form factor studied, it was determined that the skin temperature limit for a plastic enclosure was about 45 C, and for aluminum enclosure it was about 41 C.

Publisher

ASMEDC

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3