Affiliation:
1. AT&T Bell Laboratories, Murray Hill, New Jersey 07974
Abstract
The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
12 articles.
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