An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life-Reference-Cited by-同舟云学术

An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

Published:1999-03-01 Issue:1 Volume:121 Page:31-36
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Scholand A. J.¹,Fulton R. E.¹,Bras B.²

Affiliation:

1. Advanced Electronic Packaging Laboratory, Manufacturing Research Center, 813 Ferst Drive, NW, Georgia Institute of Technology, Atlanta, GA 30332

2. System Realization Laboratory, George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA

Abstract

Thermal considerations in printed wiring board (PWB) assemblies are becoming increasingly important as packaging constraints shrink and power use escalates. In this paper, we provide a study on the potential for a genetic algorithm-driven PWB layout design tool to improve the thermal performance of such assemblies. As a case study, the thermomechanical fatigue of surface mounted leadless chip carriers on an FR4 epoxy board is used. We have found that by utilizing appropriate formula-based engineering approximations, the efficiency of parallel implementations of genetic algorithms in finding near-optimal and results makes this approach effective as an explorative “scouting” approach to identify promising board configurations for more computationally expensive evaluations such as finite element method.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/121/1/31/5736326/31_1.pdf

Reference23 articles.

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