Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling-Reference-Cited by-同舟云学术

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Published:2020-06-04 Issue:1 Volume:143 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Li Yongtong¹,Gong Liang²,Xu Minghai²,Joshi Yogendra³

Affiliation:

1. College of New Energy, China University of Petroleum (East China), Qingdao 266580, China; The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

2. College of New Energy, China University of Petroleum (East China), Qingdao 266580, China

3. The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

Abstract

Abstract In this paper, a concept of metal foam heat sink with pin fins (MFPF heat sink) is proposed to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations are carried out to investigate the thermohydraulic performance of MFPF heat sink, and the metal foam (MF) heat sink and traditional pin fin (PF) heat sink are employed for comparison. The capability of MFPF heat sink in handling nonuniform heat flux is examined under different power levels. It indicates that the MFPF heat sink greatly enhances the heat transfer performance, due to the common effects of the improved flow distribution and enhanced overall effective thermal conductivity (ETC). Results also show that the MFPF heat sink promotes the improvement of the bottom wall temperature uniformity. Porosity has more pronounced effects on heat transfer performance of MFPF heat sink than pore density. A nonuniform distribution heat flux (15–80–15 W/cm2) can be successfully dissipated using the proposed MFPF heat sink with the junction temperature below 95 °C at Re of 500.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4046756/6540212/ep_143_01_011006.pdf

Reference31 articles.

1. Enhanced Heat Transfer in Plate Fin Heat Sink With Dimples and Protrusions;Heat Mass Transfer,2019

2. Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach;ASME J. Electron. Packag.,2019

3. Geometric Mean of Fin Efficiency and Effectiveness: A Parameter to Determine Optimum Length of Open-Cell Metal Foam Used as Extended Heat Transfer Surface;ASME J. Heat Transfer,2017

4. Enhancing the Performance of Aluminum Foam Heat Sinks Through Integrated Pin Fins;Int. J. Heat Mass Transfer,2020

5. Thermal Performance of Miniscale Heat Sink With Jet Impingement and Dimple/Protrusion Structure;ASME J. Heat Transfer,2017

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