Affiliation:
1. CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742
Abstract
This paper illustrates the micromechanics approach to cyclic creep-fatigue damage of Pb-Sn, developed by the authors with the help of a simple case study. It is demonstrated that durability predictions can be made based solely on monotonic test data. Various parametric studies of practical interest are conducted to obtain mechanistic insights into various aspects of damage in solders e.g., effect of hydrostatic stresses, grain size, ramp rate, etc.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Sharma, P., and Dasgupta, A., 2002, “Micro-Mechanics Of Creep-Fatigue Damage In Pb-Sn Solder Due To Thermal Cycling: Part I (Formulation),” ASME J. Electron. Packag., published in this issue, pp.
2. Sharma, P., 2000, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.
3. Sharma, P., and Dasgupta, A., submitted to the Journal of Applied Physics.
4. Sharma, P., and Dasgupta, A., 2001, ASME J. Eng. Mater. Technol.
5. Cocks, A. C. F., and Ashby, M. F., 1982, “On creep fracture by void growth,” Prog. Mater. Sci., 27, pp. 189–244.
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