Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder
Author:
Zhao and J.1, Mutoh Y.1, Ogawa T.2
Affiliation:
1. Nagaoka University of Technology, Nagaoka, 940-2188, Japan 2. Aoyama Gakuin University, Setagaya, Tokyo, 157-8572, Japan
Abstract
The stress ratio effect on the fatigue crack growth behavior of 95Pb-5Sn solder has been investigated. It is found that both ΔJ and ΔK can correlate fatigue crack growth data well, which means that the crack growth behavior of the 95Pb-5Sn solder under the frequency of 10 Hz was dominantly cyclic dependent. The da/dN-ΔJ relationship can be expressed as: da/dN=1.1×10−11s˙ΔJ1.45. Low level of crack closure was found only in the near-threshold region. Except in this region, no crack closure was observed in the present test conditions. Both transgranular and intergranular fractures were observed on fracture surfaces: the former was dominant in most test conditions and the latter was dominant at the high stress ratio of 0.7. Striations and striation-like features were also found. Many slip bands and cavities along the grain boundary were observed on the crack wake and ahead of the crack tip in the high crack growth rate region.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference24 articles.
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