Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint-Reference-Cited by-同舟云学术

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Published:2016-03-23 Issue:2 Volume:138 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Tan Yansong¹,Li Xin²³,Mei Yunhui²³,Chen Gang¹,Chen Xu⁴

Affiliation:

1. School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China

2. School of Material Science and Engineering, Tianjin University;

3. Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China

4. Mem. ASME School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China e-mail:

Abstract

A series of dwell-fatigue tests were conducted on nanosilver sintered lap shear joint at elevated temperatures from 125 °C to 325 °C. The effects of temperature and loading conditions on dwell-fatigue behavior of nanosilver sintered lap shear joint were systematically studied. With higher temperature and longer dwell time, creep played a more important part in dwell-fatigue tests. Creep strain accumulated during maximum shear stress hold was found partly recovered by the subsequent cyclic unloading. Both the fracture mode and silver particle growth pattern were characterized by X-ray tomography system and scanning electron microscope (SEM). The mean shear strain rate γ˙m synthesized the effects of various factors, such as temperature, shear stress amplitude, mean shear stress, and dwell time, by which the fatigue and dwell-fatigue life of nanosilver sintered lap shear joint could be well predicted within a factor of two.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4032880/6141820/ep_138_02_021001.pdf

Reference36 articles.

1. Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures;J. Electron. Mater.,2012

2. Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study;ASME J. Electron. Packag.,2015

3. Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves;ASME J. Electron. Packag.,2010

4. Creep–Fatigue Crack Propagation in Lead-Free Solder under Cyclic Loading With Various Waveform;Eng. Fract. Mech.,2010

5. The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method;ASME J. Electron. Packag.,2008

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube;Materials Science in Semiconductor Processing;2024-05

2. Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling;Engineering Failure Analysis;2023-12

3. Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation;Microelectronics Reliability;2021-09

4. Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates;Soldering & Surface Mount Technology;2019-12-05

5. Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint;Die-Attach Materials for High Temperature Applications in Microelectronics Packaging;2019