Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes-Reference-Cited by-同舟云学术

Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes

Published:2014-08-18 Issue:11 Volume:136 Page:112901
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:J. Heat Transfer

Author:

Ababneh Mohammed T.¹,Chauhan Shakti²,Chamarthy Pramod³,Gerner Frank M.⁴

Affiliation:

1. Department of Mechanicaland Materials Engineering,Microscale Heat Transfer Laboratory,University of Cincinnati,Cincinnati, OH 45221-0018e-mail: ababnemt@mail.uc.edu;mohammed.ababneh@1-act.com

2. GE Global Research Center,Niskayuna, NY 12309e-mail: chauhan@ge.com

3. CoolChip Technologies,Boston, MA 02111e-mail: pramodchamarthy@gmail.com

4. University of Cincinnati,Cincinnati, OH 45221-0018e-mail: Frank.Gerner@uc.edu

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://heattransfer.asmedigitalcollection.asme.org/data/journals/jhtrao/930691/ht_136_11_112901.pdf

Reference20 articles.

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2. Loop Heat Pipe Qualification for High Vibration and High-g Environments,1998

3. Thermal-Fluid Modeling for High Thermal Conductivity Heat Pipe Thermal Ground Planes;J. Thermophys. Heat Transfer,2014

4. Heat and Mass Transport in Heat Pipe Wick Structures;J. Thermophys. Heat Transfer,2007

5. Characterization and Modeling of the Heat Transfer Performance of Nanostructured Cu Micropost Wicks;ASME J. Heat Transfer,2011

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