Micro Scale Laser Shock Processing of Metallic Components
Author:
Zhang Wenwu1, Yao Y. Lawrence1
Affiliation:
1. Department of Mechanical Engineering, Columbia University, New York, NY 10027
Abstract
Laser shock processing of copper using focused laser beam size about ten microns is investigated for its feasibility and capability to impart desirable residual stress distributions into the target material in order to improve the fatigue life of the material. Shock pressure and strain/stress are properly modeled to reflect the micro scale involved, and the high strain rate and ultrahigh pressure involved. Numerical solutions of the model are experimentally validated in terms of the geometry of the shock-generated plastic deformation on target material surfaces as well as the average in-depth strains under various conditions. The residual stress distributions can be further influenced by shocking at different locations with certain spacing. The potential of applying the technique to micro components, such as micro gears fabricated using MEMS is demonstrated. The investigation also lays groundwork for possible combination of the micro scale laser shock processing with laser micromachining processes to offset the undesirable residual stress often induced by such machining processes.
Publisher
ASME International
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering
Reference13 articles.
1. White, R. M.
, 1963, “Elastic Wave Generation by Electron Bombardment or Electromagnetic Wave Absorption,” J. Appl. Phys., 34, pp. 2123–2124. 2. Clauer, A. H., and Holbrook, J. H., 1981, “Effects of Laser Induced Shock Waves on Metals,” Shock Waves and High Strain Phenomena in Metals-Concepts and Applications, New York, Plenum, pp. 675–702. 3. Peyre, P., Scherpereel, X., Berthe, L., and Fabbro, R., 1998, “Current Trends in Laser Shock Processing,” Surf. Eng., 14, No. 5, pp. 377–380. 4. Walraven, J. A., Mani, S. S., Fleming, J. G., Headley, T. J., Kotula, P. G., Pimentel, A. A., Rye, M. J., Tanner, D. M., and Smith, N. F., 2000, “Failure Analysis of Tungsten Coated Polysilicon Micromachined Microengines,” MEMS Reliability for Critical Applications, Proceedings of SPIE, Vol. 4180, pp. 49–57. 5. Frederick, Kevin M., and Fedder, Gary K., 2000, “Mechanical Effects of Fatigue and Charge on CMOS MEMS,” MEMS Reliability for Critical Applications, Proceedings of SPIE, Vol. 4180, pp. 108–116.
Cited by
171 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
|
|