Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method
Author:
Cheruparambil K. R.1, Farouk B.1, Yehoda J. E.2, Macken N. A.3
Affiliation:
1. Department of Mechanical Engineering and Mechanics, Drexel University, 3141 Chestnut Street, Philadelphia, PA 19104 2. Diamonex Inc., Allentown, PA 18105 3. Department of Engineering, Swarthmore College, Swarthmore, PA 19081-1397
Abstract
Results from an experimental study on the rapid measurement of thermal conductivity of chemical vapor deposited (CVD) diamond films are presented. The classical thermal comparator method has been used successfully in the past for the measurement of thermal conductivity of bulk materials having high values of thermal resistance. Using samples of known thermal conductivity, a calibration curve is prepared. With this calibration curve, the comparator can be used to determine thermal conductivity of unknown samples. We have significantly modified and extended this technique for the measurement of materials with very low thermal resistance, i.e., CVD diamond films with high thermal conductivity. In addition to the heated probe, the modified comparator employs a thermoelectric cooling element of increase conductive heat transfer through the film. The thermal conductivity measurements are sensitive to many other factors such as the thermal contact resistances, anisotropic material properties, surrounding air currents and temperature, and ambient humidity. A comprehensive numerical model was also developed to simulate the heat transfer process for the modified comparator. The simulations were used to develop a “numerical” calibration curve that agreed well with the calibration curve obtained from our measurements. The modified method has been found to successfully measure the thermal conductivity of CVD diamond films. [S0022-1481(00)00804-5]
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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