On the Reverse Flow Beneath a Submerged Plate Due to Wave Action

Author:

Carter Richard W.1,Ertekin R. Cengiz1,Lin Pengzhi2

Affiliation:

1. University of Hawaii at Manoa, Honolulu, HI

2. National University of Singapore, Singapore

Abstract

A water wave, passing over a horizontal plate submerged beneath the free surface, would experience above the plate both a change in wave height and wavelength. On leaving the plate, the wave, in general, encounters a reduction in wave height as compared to the incident wave. The reduction in the wave height depends upon the wavelength, the plate length and its position below the free surface, i.e., the submergence depth, as well as the water depth. Depending on the particular flow configuration, a pulsating reverse flow can occur beneath the plate, in a direction opposite to that of wave propagation. This pulsating two-dimensional flow field has been proposed by others as a method to convert wave energy into electrical energy. The main objective of this paper is to study the reverse flow beneath a submerged plate by surface wave action in finite water depth. A 2-D numerical model that uses the boundary-element method is developed to simulate this physical event by solving the linear equations of motion for waves in an ideal fluid. In addition, the Reynolds-Averaged Navier-Stokes equations are used to solve the nonlinear equations of motion for waves in a viscous fluid by use of the Fractional-Step Method. The numerically obtained linear and nonlinear results are compared with the available experimental data.

Publisher

ASMEDC

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3