Thermal Energy Storage Heat Exchanger Design: Overcoming Low Thermal Conductivity Limitations of Phase-Change Materials

Author:

Messenger Melissa A.1,Manglik Raj M.2,Boetcher Sandra K.S.1

Affiliation:

1. Department of Mechanical Engineering, Embry-Riddle Aeronautical University, Daytona Beach, FL 32114

2. Department of Mechanical and Materials Engineering, University of Cincinnati, Cincinnati, OH 45221

Abstract

Abstract Recently, there has been a renewed interest in solid-to-liquid phase-change materials (PCMs) for thermal energy storage (TES) solutions in response to ambitious decarbonization goals. While PCMs have very high thermal storage capacities, their typically low thermal conductivities impose limitations on energy charging and discharging rates. Extensive research efforts have focused on improving PCM thermal conductivity through the incorporation of additives. However, this approach presents challenges such as achieving uniform mixtures, maintaining high latent heat, and cost. Alternatively, it has been demonstrated that, in this study, reducing the length scale of the PCM-encasement thickness can eliminate the low thermal conductivity effect of PCMs. To illustrate this concept, a one-dimensional PCM slab was numerically simulated. The thickness of the slab was varied to represent dimensions found in flow passages of compact heat exchangers, and the heat transfer coefficient of the heating fluid was varied to represent lower and upper bounds while also including nominal values encountered in air-to-air heat exchangers. The thermal conductivity was parametrically varied from the natural value of the PCM to simulated enhanced values (potentially achieved through additives) of up to 400 times larger. Results show that reducing the PCM-encasement thickness yields substantially better performance than by improving the thermal conductivity, thereby demonstrating the potential for compact heat exchanger design to overcome the PCM thermal conductivity limitations.

Funder

Division of Graduate Education

Publisher

ASME International

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