Solder Joint Reliability Prediction by the Integrated Matrix Creep Method-Reference-Cited by-同舟云学术

Solder Joint Reliability Prediction by the Integrated Matrix Creep Method

Published:1996-06-01 Issue:2 Volume:118 Page:55-61
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Iannuzzelli R. J.¹,Pitarresi J. M.²,Prakash V.²

Affiliation:

1. Process Reliability and Advanced Development, Digital Equipment Corporation, Maynard, MA 01754

2. Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902

Abstract

The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/118/2/55/5582368/55_1.pdf

Reference8 articles.

1. Bonner, K. and Cornford, S., 1994, “Summary of Phase I Round Robin Solder Joint Life Prediction Model Results,” JPL Technical Report, Oct.

2. Constable, J., 1993, Private Communication, Elec. Eng. Dept., SUNY Binghamton.

3. Fultyn, R. V. 1989, “Statistical Analysis of Solder Joint Pull Strength of 50 mil Pitch Rigid Gull Wing and J-bend SMT Devices,” Internal report #TR89–0052/SMTE, Digital Equipment Corp.

4. Fultyn, R. V., 1989, “Statistical Analysis of Solder Joint Pull Strength of 25 mil Pitch Rigid Gull Wing SMT Devices,” Internal report #TR90–0062/SMTE, Digital Equipment Corp.

5. Iannuzzelli, R. J., 1992, “Predicting Solder Joint Reliability - Model Validation,” Proc 43rd ECTC, June, pp. 839–851.

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