1. Drop Test Reliability of Wafer Level Chip Scale Packages;Alajoki
2. The Reliability of Microelectromechanical Systems (MEMS) in Shock Environments;Srikar;J. Microelectromech. Syst.
3. Fan, M. S., and Shaw, H. C., 2001, “Dynamic Response Assessment for the MEMS Accelerometer Under Severe Shock Loads,” National Aeronautics and Space Administration NASA, Report No. TP-2001-209978.
4. Design and Processes Consideration for Fabrication RF MEMS Switches on Printed Circuit Boards;Chang;J. Microelectromech. Syst.
5. Ghaffarian, R., Sutton, D., Chaffee, P., Marquez, N., Sharma, A., and Teverovsky, A., 2002, “Thermal and Mechanical Reliability of Five COTS MEMS Accelerometers,” NASA Electronic Parts and Packaging Program, http://nepp.nasa.gov/eeelinks/February2002/Thermal_and_Mechanical_Reliability.pdf