Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Author:

Chin Melida1,Hu S. Jack1,Barber James R.1

Affiliation:

1. Department of Mechanical Engineering, The University of Michigan, 2250 G. G. Brown, 2350 Hayward Street, Ann Arbor, MI 48109-2125

Abstract

Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important parameters include initial bonding force F, number of particles N, the adhesion strength GA, and modulus of elasticity E of the cured resin. It is well known that as the bonding force increases, the contact resistance decreases. However, when the bonding force reaches a certain maximum value, the contact between conductive particle and conductive track is disrupted due to delamination of the cured resin during the elastic recovery. The authors have shown in previous studies that the delamination is caused by high residual stresses and that it largely depends on the adhesion strength of the assembly and on the modulus of elasticity of the cured resin. Additionally, the authors have provided a methodology to quantify the maximum threshold value of the bonding force for different numbers of particles trapped between mating conductive tracks. In this paper, the relationships between contact resistance R and each one of these parameters are systematically investigated to create diagrams that give regions of robust design. Given the number of particles and their size, adhesion strength, and modulus of elasticity of the resin, the required bonding force can be found in order to achieve a desired range in contact resistance.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assemblies;Chin;IEEE Trans. Compon. Packag. Technol.

2. Design and Understanding of Anisotropic Conductive Adhesive (ACF’s) for LCD Packaging;Yim;IEEE Trans. Compon., Packag. Manuf. Technol., Part A

3. Electro-Thermo-Mechanical Responses of Conductive Adhesive Materials;Hu;IEEE Trans. Compon., Packag. Manuf. Technol., Part A

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3