Investigation of Flip-Chip Bonding for MEMS Applications
Author:
Salalha W.1, Zussman E.1, Bar-Yoseph P. Z.2
Affiliation:
1. Manufacturing Systems Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000 2. Computational Mechanics Laboratory, Faculty of Mechanical Engineering, Technion-Israel Institute of Technology, Haifa, Israel 32000
Abstract
An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. It was found that in typical cases of MEMS devices in which the solder volume is small (Bo≪1, where Bo is the Bond number), the finite element solution of the axisymmetric solder joint is well approximated by a surface of revolution whose generating meridian is a circular arc. Experimental results of solder joints in flip-chip assembly were found to correlate well with simulation results.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference16 articles.
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, 1969, “Geometric Optimization of Controlled Collapse Interconnections,” IBM J. Res. Dev., 13, pp. 251–265. 5. Heinrich, S. M., Schaefer, M., Schoroeder, S. A., and Lee, P. S., 1996, “Prediction of Solder Joint Geometries in Array-Type Interconnects,” ASME J. Electron. Packag., 118(3), pp. 114–121.
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