Thermal Bubble Formation on Polysilicon Micro Resistors
Author:
Affiliation:
1. Department of Mechanical Engineering and Applied Mechanics, University of Michigan, Ann Arbor, MI 48109-2125
2. Department of Mechanical Engineering, University of California at Berkeley, Berkeley, CA 94720
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/heattransfer/article-pdf/120/3/735/5911056/735_1.pdf
Reference31 articles.
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2. Ansoft, C., 1990, “Maxwell Solver,” 4 Station Square, 660 Commerce Court Building, Pittsburgh, PA, v. 4.33.
3. Baker E. , 1972, “Liquid Cooling of Microelectronic Devices by Free and Forced Convection,” Microelectronics and Reliability, Vol. 11, pp. 213–222.
4. Baker E. , 1973, “Liquid Immersion Cooling of Small Electronic Devices,” Microelectronics and Reliability, Vol. 12, pp. 163–173.
5. Bakhru N. , and LienhardJ., 1972, “Boiling from Small Cylinders,” Int. J. of Heat Mass Transfer, Vol. 15, pp. 2011–2025.
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