Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling-Reference-Cited by-同舟云学术

Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling

Published:2014-05-12 Issue:3 Volume:136 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Hao Xiaohong¹,Peng Bei²,Xie Gongnan³,Chen Yi⁴

Affiliation:

1. School of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China

2. School of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, China e-mail:

3. School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China e-mail:

4. School of Engineering and Built Environment, Glasgow Caledonian University, Glasgow G4 0BA, UK e-mail:

Abstract

In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained using a thermal resistance network model based on the equivalent thermal circuit method. Pressure drop is derived considering straight channel and bend loss because the bends interrupt the hydrodynamic boundary periodically. Considering the effects of laminar flow development and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a three-regime correlation. The model is then experimentally validated by measuring the temperature and pressure characteristics of heat sinks with different Reynolds numbers and different geometric parameters. Finally, the temperature-rise and pressure distribution of the thermal fluid with Reynolds numbers of 500, 1000, and 1500 are examined utilizing this model.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4027508/6140821/ep_136_03_031009.pdf

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