Thermal Stresses From a Moving Band Source of Heat on the Surface of a Semi-Infinite Solid

Author:

Mercier R. J.1,Malkin S.2,Mollendorf J. C.3

Affiliation:

1. Pratt & Whitney Aircraft, West Palm Beach, Fla.

2. Material Processing & Machine Tool Center, Technion–Israel Institute of Technology, Haifa, Israel

3. Department of Mechanical Engineering, State University of New York, Buffalo, N. Y.

Abstract

Thermoelastic stresses arising from a moving band source of heat on the surface of a semi-infinite solid have been calculated using well-known temperature solutions and a finite element stress analysis. Results are presented in nondimensional form for a wide range of conditions for both quasi-steady state and transient regimes. The effect of convective cooling at the surface has also been investigated. Peak stresses, which occur at the surface, have been related to a modified source Peclet number for instances in which surface cooling is not employed. Reduction in stress levels due to convective cooling at the surface has also been determined. For all cases considered, the greatest stress levels were found to occur at the surface of the constrained direction. Using results obtained in this study, thermoelastic stresses in sliding and machining processes may be calculated in order to predict the onset of yielding which can result in residual tensile stresses and cracking.

Publisher

ASME International

Subject

General Medicine

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3