1. Ind, P., and Ewins, D., 2003, “Impedance Based Decoupling and Its Application to Indirect Modal Testing and Component Measurement: A Numerical Investigation,” 21st International Modal Analysis Conference, Kissimmee, FL, Feb. 3–6, p. 9.http://semimac.org/wp-content/uploads/2016/05/sem.org-IMAC-XXI-Conf-s11p03-Impedance-Based-Decoupling-its-Application-Indirect-Modal-Testing.pdf
2. A Benchmark Test Structure for Experimental Dynamic Substructuring,2011
3. D'Ambrogio, W., and Fregolent, A., 2004, “Decoupling of a Substructure From Modal Data of the Complete Structure,” International Conference on Noise and Vibration Engineering (ISMA), Leuven, Belgium, Sept. 20–22, pp. 2693–2706.
4. Okubo, N., and Miyazaki, M., 1984, “Development of Uncoupling Technique and Its Application,” Fourth International Modal Analysis Conference, New York, Feb., pp. 1194–1200.
5. Prediction of Substructure Properties Using Decoupling Procedures;EURODYN,2005