Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant-Reference-Cited by-同舟云学术

Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant

Published:2017-06-30 Issue:3 Volume:139 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Liu Yuan¹,Dai Jinyue²,Liu Xiaoqing³,Luo Jun⁴,You Shusen²,Zhu Jin²,Ma Songqi²,Jia Zhen⁵

Affiliation:

1. Polymer and Composites Division, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; Engineering Research Center for Materials Protection of Wear and Corrosion of Guizhou Province, Guiyang University, Guiyang 550005, China; University of Chinese Academy of Sciences, Beijing 100049, China

2. Polymer and Composites Division, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; University of Chinese Academy of Sciences, Beijing 100049, China

3. Polymer and Composites Division, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; University of Chinese Academy of Sciences, Beijing 100049, China e-mail:

4. Engineering Research Center for Materials Protection of Wear and Corrosion of Guizhou Province, Guiyang University, Guiyang 550005, China

5. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; University of Chinese Academy of Sciences, Beijing 100049, China

Abstract

In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4′-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (1H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 °C and higher residues at 800 °C than that of DGEBA.

Funder

National Natural Science Foundation of China

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4036818/6142555/ep_139_03_031006.pdf

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