Soft Tactile Skin Using an Embedded Ionic Liquid and Tomographic Imaging

Author:

Chossat Jean-Baptiste1,Shin Hee-Sup2,Park Yong-Lae3,Duchaine Vincent1

Affiliation:

1. École de Technologie Supérieure, Montréal, QC H3C 1K3, Canada e-mail:

2. Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213 e-mail:

3. Robotics Institute, School of Computer Science, Carnegie Mellon University, Pittsburgh, PA 15213 e-mail:

Abstract

Whole-body-contact sensing will be crucial in the quest to make robots capable of safe interaction with humans. This paper describes a novel design and a fabrication method of artificial tactile sensing skin for robots. The manufacturing method described in this paper allows easy filling of a complex microchannel network with a liquid conductor (e.g., room temperature ionic liquid (RTIL)). The proposed sensing skin can detect the magnitude and location of surface contacts using electrical impedance tomography (EIT), an imaging technique mostly used in the medical field and examined recently in conjunction with sensors based on a piezoresistive polymer sheet for robotic applications. Unlike piezoresistive polymers, our IL-filled artificial skin changes its impedance in a more predictable manner, since the measured value is determined by a simple function of the microchannel geometry only, rather than complex physical phenomena. As a proof of concept, we demonstrate that our EIT artificial skin can detect surface contacts and graphically show their magnitudes and locations.

Publisher

ASME International

Subject

Mechanical Engineering

Reference49 articles.

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2. Cheung, E., and Lumelsky, V., 1989, “Development of Sensitive Skin for a 3D Robot Arm Operating in an Uncertain Environment,” IEEE International Conference on Robotics and Automation, Scottsdale, AZ, May 14–19, pp. 1056–1061.10.1109/ROBOT.1989.100121

3. Sensitive Skin;IEEE Sens. J.,2001

4. Cannata, G., Maggiali, M., Metta, G., and Sandini, G., 2008, “An Embedded Artificial Skin for Humanoid Robots,” IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2008), Seoul, South Korea, Aug. 20–22, pp. 434–438.10.1109/MFI.2008.4648033

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