A Painting Technique to Enhance Pool Boiling Heat Transfer in Saturated FC-72

Author:

O’Connor J. P.1,You S. M.1

Affiliation:

1. Department of Mechanical Engineering, University of Texas at Arlington, Arlington, TX 76019-0023

Abstract

A benign method of generating a surface microstructure that provides pool boiling heat transfer enhancement is introduced. Pool boiling heat transfer results from an enhanced, horizontally oriented, rectangular surface immersed in saturated FC-72, indicate up to an 85 percent decrease in incipient superheat, a 70 to 80 percent reduction in nucleate boiling superheats, and a ∼ 109 percent increase in the critical heat flux (CHF = 30 W/cm2), beyond that of the nonpainted reference surface. For higher heat flux conditions (19 to 30 W/cm2), localized dryout results in increased wall superheats (8 to 48°C). The enhanced surface heat transfer coefficients are four times higher than those from the reference surface and similar to those from the Union Carbide High Flux surface. Photographs that identify differences in bubble size and departure characteristics between the painted and reference surfaces are presented.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference25 articles.

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2. Anderson, T. M., and Mudawwar, I., 1988, “Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid,” Proc. of National Heat Transfer Conf., ASME HTD-Vol. 96, pp. 551–560.

3. Bar-Cohen A. , and SimonT. W., 1988, “Wall Superheat Excursions in the Boiling Incipience of Dielectric Fluids,” Heat Transfer Eng., Vol. 9:1, pp. 19–31.

4. Bar-Cohen, A., and McNeil, A., 1992, “Parametric Effects on Pool Boiling Critical Heat Flux in Dielectric Liquids,” Proc. of Eng. Foundation Conference, Pool and External Flow Boiling, Santa Barbara, CA, pp. 171–175.

5. Carvalho, R. D., and Bergles, A. E., 1990a, “The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips,” Proc. of the 9th International Heat Transfer Conf., Jerusalem, Israel, pp. 289–294.

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