Electrically Conductive Adhesive Formulations for SMT Applications

Abstract

The aim of current research presented in my paper is to establish how adhesive composition influences the performance of joints between SMDs and PCBs. For identifying the best adhesive formulation in SMT applications, the experiment design method based on Taguchi techniques for quality engineering has been used. It was decided to investigate how the following controllable factors: type of isolating resin, levels of weight content of Ag filler, presence of adhesive promoter and spread improver as well as PCB pads finishing influences the performance of adhesive joints. As the figure-of-merit, the individual joint resistance and adhesion between SMDs and PCBs were measured. It was found that the type of resin had the biggest influence on electrical and mechanical properties of adhesive joints.