Determination of some physical and mechanical properties of parallel-strand lumber manufactured with bamboo (Phyllostachys bambusoides)

Author:

Çavuş Vedat1,Ersin İbrahim2

Affiliation:

1. Izmir Katip Celebi University

2. Izmir Buca / Suleyman Sah Vocational and Technical Anatolian High School

Abstract

Parallel-strand lumber was manufactured with bamboo (Phyllostachys bambusodies). A polyol compound was added to modify the adhesive (pMDI). Bamboo culms were used to manufacture strands 3 mm thick, 19 mm wide, and 65 cm long. Adhesive was applied to the strands at 200 g/m2 with pressing at 110 °C, 15 kg/cm2, and 30 min. Panels were made with width 600 mm, length 600 mm, and thickness 20 mm. Some physical properties (oven-dry density, air-dry density, moisture content, thickness swelling, and water absorption percentage) and mechanical properties (bending resistance, modulus of elasticity, impact resistance, screw-holding capacity in tangential, radial, and transverse directions) of parallel-strand lumber for both adhesive types were determined. Both resin types improved some physical and mechanical properties of parallel-strand lumber. Additionally, the modulus of rupture and flexural modulus of elasticity of the test specimens using pMDI+5%MP adhesive were higher than those of the test specimens using pMDI. The average screw-holding capacity values of the test specimens were affected by the fiber aspect of the specimens rather than the adhesive type. Parallel-strand lumber produced from both pMDI and pMDI+5%MP adhesives can be used in structural applications, especially in places exposed to the disturbing effects of weather.

Publisher

BioResources

Subject

Waste Management and Disposal,Bioengineering,Environmental Engineering

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Parallel strand lumber made from pine veneer;Annals of WULS, Forestry and Wood Technology;2024-03-31

2. An In-Depth Review on the Eccentric Compression Performance of Engineered Bamboo Columns;Civil Engineering Journal;2024-03-01

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