Effects of preservative pretreatments on moisture adsorption and desorption properties of corn stalk fiber/high-density polyethylene composites

Author:

Xuan Lihui1,Hui Dongxue1,Wang Dong1,Cheng Wanli1,Han Guangping1

Affiliation:

1. Northeast Forestry University

Abstract

The impact of alkaline copper quat (ACQ) and zinc borate (ZB) on the moisture adsorption and desorption properties and leaching resistance of corn stalk fiber (CSF) reinforced high-density polyethylene (HDPE) composites was investigated. The equilibrium moisture content (EMC) was fitted by the Nelson model, and the interaction between the CSF component and the preservatives was characterized by Fourier transform infrared spectroscopy (FTIR). The effective components of the preservative were successfully immobilized on the CSF, which was observed by FTIR analysis. The leaching resistant analysis showed that the leaching amount of copper and boron elements reached a plateau, and that the leaching resistant performance in the ACQ treatment was better than in ZB. The moisture adsorption of CSF/HDPE composites was significantly reduced with ACQ treatment at low CSF content, but clearly increased in ZB treatment at high CSF content. The moisture adsorption and desorption EMC increased with the increased preservative (ACQ or ZB) embedding at a given CSF/HDPE component ratio. The experimental values were fitted well with the Nelson model; thereby this model could be used to predict the moisture adsorption and desorption EMC of CSF/HDPE composites at various relative humidity.

Publisher

BioResources

Subject

Waste Management and Disposal,Bioengineering,Environmental Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3