Improvement of Diffusion Bondability on Chromium-Copper Alloy by Behavior of Oxide Layer at High Temperature-Reference-Cited by-同舟云学术

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Improvement of Diffusion Bondability on Chromium-Copper Alloy by Behavior of Oxide Layer at High Temperature

Published:2016 Issue:3 Volume:80 Page:206-212
ISSN:0021-4876
Container-title:Journal of the Japan Institute of Metals
language:en
Short-container-title:J. Japan Inst. Metals and Materials

Author:

Tsukamoto Masaaki¹

Affiliation:

1. Department of Material Science and Synchrotron Radiation Engineering, Graduate School of Engineering, University of Hyogo

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://www.jstage.jst.go.jp/article/jinstmet/80/3/80_JBW201510/_pdf

Reference15 articles.

1. 1) H. Takegami and T. Shinoda: Quarterly Journal of JWS 22(2004) 477–483.

2. 2) M. Tsukamoto, S. Sakamoto and A. Yamamoto: J. Japan Inst. Metals 75(2011) 592–599.

3. 3) M. Tsukamoto and A. Yamamoto: J. Japan Inst. Metals 76(2012) 338–344.

4. 4) M. Tsukamoto, T. Kajiura and A. Yamamoto: J. Japan Inst. Metals 76(2012) 521–527.

5. 5) O. Ohashi, K. Tanuma and T. Kimura: Quarterly Journal of JWS 4(1986) 53–59.

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