Grain-Boundary Sliding and Its Accommodation at Triple Junctions in Aluminum and Copper Tricrystals
Author:
Affiliation:
1. Division of Science and Technology, Tokushima University
2. Graduate School of Advanced Technology and Science, Tokushima University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/60/1/60_M2018296/_pdf
Reference35 articles.
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3. 3) F. Sorbello, G.M. Hughes, P. Lejček, P.J. Heard and P.E.J. Flewitt: Ultramicroscopy 109 (2009) 147–153.
4. 4) P. Lejček, P. Šedá, Y. Kinoshita, V. Yardley, A. Jäger and S. Tsurekawa: J. Mater. Sci. 47 (2012) 5106–5113.
5. 5) B. Zhao, A. Ziemons, L.S. Shvindlerman and G. Gottstein: Acta Mater. 60 (2012) 811–818.
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