High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire-Reference-Cited by-同舟云学术

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High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire

Published:2002 Issue:8 Volume:43 Page:2157-2160
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Onuki Jin¹,Komiyama Takao¹,Chonan Yasunori¹,Koizumi Masahiro¹

Affiliation:

1. Department of Electronics and Information Systems, Faculty of Systems Science and Technology,Akita Prefectural University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/43/8/43_8_2157/_pdf

Reference15 articles.

1. 1) J. Kassakian, M. Schiechi and G. Verghese: Principles of Power Electronics, (Addison-Wesley, 1991) Chap. 16.

2. 2) M. Mori, R. Saitou and T. Yatsuo: Proc. 5th ISPSD (1993) p. 287–291.

3. 3) R. Saitou and M. Mori: OHM 81 (1994) 33–37 (in Japanese).

4. 4) Y. Takahashi, T. Koga, H. Kirihara and Y. Seki: Proc. 6th ISPSD(1994) p. 25–28.

5. 5) W. Wu, M. Held, P. Jacob, P. Scacco and A. Birolini: Proc.7th ISPSD (1995) p. 330.

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1. Development of Damage Free Thick Al-Cu Wire Bonding Process and Reliability of the Wire Bonds;Electrochemistry;2014

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