Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps

Author:

Terashima Shinichi1,Uno Tomohiro1,Hashino Eiji1,Tatsumi Kohei1

Affiliation:

1. Advanced Technology Research Laboratories, Nippon Steel Corp.

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. 1) J. H. Lau: Flip Chip Technologies, (McGraw-Hill, New York, 1996) pp. 1–82.

2. 2) D. Tribula: U.S. DOE Report, LBL-29018 (1990) 1–78.

3. 3) National Center for Manufacturing Sciences: Lead-Free Solder Project Final Report, Section 2, (National Center for Manufacturing Sciences, Michigan, 1997) pp. 1–14.

4. 4) S. Terashima, T. Uno, E. Hashino and K. Tatsumi: Proc. 7th Symp. on Microjoining and Assembly Technology in Electronics (2001) pp. 125–130.

5. 5) B. F. Dyson: J. Appl. Phys. 37 (1966) 2375–2377.

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