Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application
Author:
Affiliation:
1. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
2. Institute of Scientific and Industrial Research, Osaka University
3. Department of Materials Engineering, Pusan National University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200809/_pdf
Reference20 articles.
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2. 2) K. C. Reinhardt and M. A. Marciniak: Proc. 3rd Int. High-Temperature Electronics Conf., (Albuquerque, NM, 1996) pp. 9–15.
3. 3) P. G. Neudeck, R. S. Okojie and L. Y. Chen: Proc. of IEEE 90 (2002) 1065–1076.
4. 4) H. Ueda: Proc. The 17th Inter. Symp. Power devices and IC’s, (IEEE, 2005) p. 147.
5. 5) M. Bratcher, R. J. Yoon and B. Whitworth: Proc. 3rd Int. High-Temperature Electronics Conf., (Albuquerque, NM, 1996) pp. 21–26.
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