Properties of Solder Joints Using Sn-Ag-Bi-In Solder-Reference-Cited by-同舟云学术

Properties of Solder Joints Using Sn-Ag-Bi-In Solder

Published:2004 Issue:4 Volume:45 Page:1282-1289
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Yamaguchi Atsushi¹,Yamashita Yuhei¹,Furusawa Akio¹,Nishida Kazuto¹,Hojo Takashi²,Sogo Yosuke²,Miwa Ayako²,Hirose Akio²,Kobayashi Kojiro F.²

Affiliation:

1. Corporate Manufacturing Innovation Division, Matsushita Electric Industrial Co., Ltd.

2. Deparrment of Manufacturing Science, Graduate School of Engineering, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/45/4/45_4_1282/_pdf

Reference12 articles.

1. 1) Takemoto: Welding Technique 47 (1999) 98-105.

2. 2) Fujimoto: J. Japan Inst. Electronics Packaging 3 (2000) 431-434.

3. 3) H. Iwanishi, T. Imamura, A. Hirose and K.F. Kobayashi: Proc. 8th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp.277-282.

4. 4) A. Yamaguchi, A. Furusawa, H. Otani, J. Ikeda, H. Iwanishi, T. Hojo, A. Hirose and K.F. Kobayashi: Proc. 6th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp.295-300.

5. 5) A. Yamaguchi, A. Furusawa, H. Iwanishi, T. Hojo, Y. Sogo, A. Hirose and K.F. Kobayashi: Proc. 6th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2003) pp.309-314.

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