Effect of Grain Boundary Sliding on the Creep Micro-Deformation of Copper
Author:
Affiliation:
1. National Research Institute for Metals
Publisher
Japan Institute of Metals
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/matertrans1989/32/1/32_1_67/_pdf
Reference17 articles.
1. 1) C. A. P. Horton: Acta. Met., 18 (1970), 1159.
2. 2) R. C. Gifkins: Met. Trans., 8A (1977), 1507.
3. 3) S. Kishimoto, N. Shinya, and H. Tanaka: J. Soc. Mater. Sci. Jpn., 37 (1988), 289.
4. 4) I. W. Chen and A. S. Argon: Acta. Met., 27 (1979), 749.
5. 5) M. V. Speight: Acta. Met., 24 (1976), 725.
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3. Finite Element Method Simulation of Grain Boundary Sliding: Its Purposes, Models and Applications in Fine-Grain Superplasticity;Materials Science Forum;1999-02
4. The effect of grain boundary deformation on the creep micro-deformation of copper;Acta Metallurgica et Materialia;1992-07
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