Structural Analysis of Ag/Cu Multilayered Films Prepared by Evaporation and Sputtering Methods
Author:
Affiliation:
1. Department of Metallurgy, Tokyo Institute of Technology
Publisher
Japan Institute of Metals
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/matertrans1989/32/12/32_12_1102/_pdf
Reference16 articles.
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2. 2) F. J. Lamelas, C. H. Lee, Hui He, W. Vavra and Roy Clarke: Phys. Rev., B, 40 (1989), 5837.
3. 3) Y. Nagai and M. Senda: Jpn. J. Appl. Phys., 26 (1987), L1514.
4. 4) Y. Haga, Y. Nakamura and O. Nittono: Jpn. J. Appl. Phys., 29 (1990), 696.
5. 5) M. Jalochowski and P. Mikolajczak: J. Phys., F13 (1983), 1973.
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1. Comments on the interdiffusivities evaluated by the decay rate of the satellite peak measured by X-ray diffraction;Thin Solid Films;1996-08
2. Structural features of Pb/Ag, Ag/Cu and Cu/Pb multilayers;Journal of Magnetism and Magnetic Materials;1993-09
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