Effect of Small Amount Addition of Co on Dynamic Recrystallization of Cu–Be Alloys
Author:
Affiliation:
1. Department of Mechanical and Control Enginee ring, The University of Electro-Communications
2. NGK Insulators, Ltd., New Products Development Office
Publisher
Japan Institute of Metals
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/matertrans1989/36/8/36_8_1023/_pdf
Reference21 articles.
1. 1) T. Sakai, T. Iwai and K. Nojiri: J. Japan Copper and Brass Res. Ass., 30 (1991), 99.
2. 2) T. Sakai, H. Miura, T. Iwai and N. Muramatsu: J. Japan Inst. Metals, 57 (1993), 1390.
3. 3) T. Sakai, H. Miura and N. Muramatsu: Strength of Materials (ICSMA10), Ed. by H. Oikawa et al., Japan Inst. Metals, (1994), p. 795.
4. 4) M. J. Luton and C. M. Sellars: Acta Metall., 17 (1969), 1033.
5. 5) L. Blaz, T. Sakai and J. J. Jonas: Met. Sci., 17 (1983), 609.
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