Recovery of Sn, Ag and Cu from Waste Pb-Free Solder Using Nitric Acid Leaching-Reference-Cited by-同舟云学术

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Recovery of Sn, Ag and Cu from Waste Pb-Free Solder Using Nitric Acid Leaching

Published:2012 Issue:12 Volume:53 Page:2175-2180
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Yoo Kyoungkeun¹,Lee Jae-chun²,Lee Kwang-sek¹,Kim Byung-su²,Kim Min-seuk²,Kim Soo-kyoung²,Pandey B. D.²³

Affiliation:

1. Department of Energy & Resources Engineering, Korea Maritime University

2. Minerals Resource Research Division, Korea Institute of Geoscienece & Mineral Resources (KIGAM)

3. Metal Extraction and Forming Division, CSIR-National Metallurgical Laboratory

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/53/12/53_M2012268/_pdf

Reference13 articles.

1. 1) H. Ma and J. C. Suhling: J. Mater. Sci. 44 (2009) 1141–1158.

2. 2) J. Pan, J. Wang and D. M. Shaddock: J. Microelec. Electron. Pack. 2 (2005) 72–83.

3. 3) M. Tsunekawa, Y. Sasaki, Y. Nakamura, M. Ito, N. Hiroyoshi and K. Yoo: Mater. Trans. 49 (2008) 2119–2123.

4. 4) M. A. Marino, R. M. Brica and C. N. Neale: Environ. Prog. 16 (1997) 208–214.

5. 5) L. J. Turbini, G. C. Munie, D. Bernier, J. Gamalski and D. W. Bergman: IEEE Trans. Electron. Pack. Manuf. 24 (2001) 4–9.

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