Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin–Lead Solder on “Surface Fine Crevice Structure”
Author:
Affiliation:
1. Graduate School of Engineering, Osaka University
2. University of California, Berkeley
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/57/6/57_M2015428/_pdf
Reference20 articles.
1. 1) N. Takahira, T. Yoshikawa, T. Tanaka and L. Holappa: Trans. JIM 48 (2007) 3126–3131. 10.2320/matertrans.MRA2007179
2. 2) N. Takahira, T. Yoshikawa, T. Tanaka and L. Holappa: Trans. JIM 48 (2007) 2708–2711. 10.2320/matertrans.MRA2007094
3. 3) N. Takahira, T. Tanaka, S. Hara and J. Lee: Trans. JIM 46 (2005) 3008–3014. 10.2320/matertrans.46.3008
4. 4) T. Oosawa: “Handadukegijutsu no shinjidai – erekutoronikusu no kagi”, Kogyo Chosakai Publishing Co., Ltd., Tokyo (1985).
5. 5) W. Tanaka: “Handaduke sagyo no kandokoro”, Nikkan Kogyo Shimbun, Ltd., Tokyo (1981).
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Transient liquid phase infiltration bonding of copper using porous silver insert sheet;Journal of Materials Science: Materials in Electronics;2023-07
2. Copper Surface Treatment Method with Antibacterial Performance Using “Super-Spread Wetting” Properties;Materials;2022-01-05
3. In Situ Observations of the Formation of Surface Fine Crevice Structures Created by Laser Irradiation;MATERIALS TRANSACTIONS;2021-02-01
4. Joining of Metal to Ceramic Plate Using Super-Spread Wetting;Metals;2020-10-15
5. Dissimilar Metal Joining of Cu and Fe Using Super-Spread Wetting into Surface Fine Crevice Structures;MATERIALS TRANSACTIONS;2020-10-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3