Etching Behavior and Dielectric Film Formation on Aluminum Foil Stocks for Electrolytic Capacitors: A Review
Author:
Affiliation:
1. Research & Development Center, Marketing & Technology Division, UACJ Corporation
Publisher
Japan Institute of Metals
Link
https://www.jstage.jst.go.jp/article/matertrans/65/8/65_MT-L2024006/_pdf
Reference21 articles.
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2. 2) M. Kawai, K. Yamada, T. Umezaki, A. Konishi, H. Watanabe and Y. Miura: Microstructure of surface area and etching behavior of high-purity aluminum foils for electrolytic capacitors, J. JILM 54 (2004) 211–217. doi:10.2464/jilm.54.211
3. 3) H. Tsubakino, A. Nogami, M. Terasawa, T. Mitamura, T. Yamanoi, A. Kinomura and Y. Horino: Surface segregation of lead in high-purity aluminum during heat treatment, J. JILM 52 (2002) 410–416. doi:10.2464/jilm.52.410
4. 4) C.K. Dyer and R.S. Alwitt: Surface changes during A.C. etching of aluminum, J. Electrochem. Soc. 128 (1981) 300–305. doi:10.1149/1.2127408
5. 5) N. Osawa and K. Fikuoka: Pit nucleation behavior of aluminium foil for electrolytic capacitors during early stage of DC etching, Corros. Sci. 42 (2000) 585–597. doi:10.1016/S0010-938X(99)00117-1
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